Inorganic dies with organic interconnect layers and related structures

ABSTRACT

Disclosed herein are methods to fabricate inorganic dies with organic interconnect layers and related structures and devices. In some embodiments, an integrated circuit (IC) structure may be formed to include an inorganic die and one or more organic interconnect layers on the inorganic die, wherein the organic interconnect layers include an organic dielectric. An example method includes forming organic interconnect layers over an inorganic interconnect substrate and forming passive components in the organic interconnect layer. The organic interconnect layers comprise a plurality of conductive metal layers through an organic dielectric material. The plurality of conductive metal layers comprises electrical pathways. the passive components are electrically coupled to the electrical pathways.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/721,235 filed Dec. 19, 2019 and entitled “INORGANIC DIES WITH ORGANICINTERCONNECT LAYERS AND RELATED STRUCTURES,” which is herebyincorporated by reference herein in its entirety.

BACKGROUND

Conventional integrated circuit (IC) packages typically include asilicon-based die electrically coupled to an organic material-basedpackage substrate. The electrical coupling between the die and thepackage substrate may include solder bumps or wirebonds.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments will be readily understood by the following detaileddescription in conjunction with the accompanying drawings. To facilitatethis description, like reference numerals designate like structuralelements. Embodiments are illustrated by way of example, not by way oflimitation, in the figures of the accompanying drawings.

FIGS. 1-4 are side, cross-sectional views of example integrated circuit(IC) structures including an inorganic die with organic interconnectlayers, in accordance with various embodiments.

FIGS. 5-11 illustrate stages in an example process of manufacturing theIC structure of FIG. 1, in accordance with various embodiments.

FIG. 12 is a side, cross-sectional view of an IC assembly including anIC structure, in accordance with various embodiments.

FIGS. 13-15 illustrate stages in an example process of manufacturing theIC assembly of FIG. 12, in accordance with various embodiments.

FIG. 16 depicts a back face of an IC structure including a ring-shapedcontact, in accordance with various embodiments.

FIG. 17 is a side, cross-sectional view of a lidded resonator assemblyincluding an IC structure like that of FIG. 16, in accordance withvarious embodiments.

FIGS. 18-21 are side, cross-sectional views of radio frequency (RF)front-end (FE) modules including a lidded resonator assembly, inaccordance with various embodiments.

FIGS. 22-25 illustrate stages in an example process of manufacturing theRF FE module of FIG. 18, in accordance with various embodiments.

FIGS. 26-29 illustrate stages in an example process of manufacturing theRF FE module of FIG. 20, in accordance with various embodiments.

FIGS. 30-33 illustrate stages in an example process of manufacturing theRF FE module of FIG. 21, in accordance with various embodiments.

FIG. 34 is a top view of a wafer and dies that may include ICstructures, in accordance with any of the embodiments disclosed herein.

FIG. 35 is a side, cross-sectional view of an IC device assembly thatmay include IC structures, IC assemblies, lidded resonator assemblies,and/or RF FE modules, in accordance with any of the embodimentsdisclosed herein.

FIG. 36 is a block diagram of an example electrical device that mayinclude IC structures, IC assemblies, lidded resonator assemblies,and/or RF FE modules, in accordance with any of the embodimentsdisclosed herein.

FIG. 37 is a block diagram of an example RF device that may include ICstructures, RF assemblies, lidded resonator assemblies, and/or RF FEmodules, in accordance with any of the embodiments disclosed herein.

DETAILED DESCRIPTION

Disclosed herein are inorganic dies with organic interconnect layers andrelated structures, devices, and methods. In some embodiments, anintegrated circuit (IC) structure may include an inorganic die and oneor more organic interconnect layers on the inorganic die, wherein theorganic interconnect layers include an organic dielectric.

The embodiments disclosed herein may enable small form factor modulesthat may be particularly advantageous in radio frequency (RF)communication applications, such as millimeter wave and Wi-Fi. Forexample, next generation RF devices may need to support an increasingnumber of frequency bands that can be clearly separated from each other.Doing so may require high-quality factor (high-Q) filter circuits foreach supported band. Manufacturing RF devices with such capabilitiesusing conventional approaches typically results in a device with anextremely large form factor. The embodiments disclosed herein, however,may achieve high performance while maintaining or reducing device formfactors. For example, in some embodiments, an inorganic substrate maysupport thick organic interconnect layers in which inductors may beintegrated. Such integrated inductors may be part of the filtercircuits, and may help provide higher quality filtering with a smallerform factor than conventionally achievable. The thick organicinterconnect layers may reduce losses relative to thinner interconnects,and the use of low-loss organic dielectric materials may further reducelosses. Additionally, embodiments in which the inorganic substrate(e.g., silicon) is exposed may enable the use of such exposed materialas a hermetic seal for resonator structures (functionality notachievable with conventional organic substrates), and electricalpathways through the inorganic substrate may provide electricalconnectivity to the resonators.

In the following detailed description, reference is made to theaccompanying drawings that form a part hereof wherein like numeralsdesignate like parts throughout, and in which is shown, by way ofillustration, embodiments that may be practiced. It is to be understoodthat other embodiments may be utilized, and structural or logicalchanges may be made, without departing from the scope of the presentdisclosure. Therefore, the following detailed description is not to betaken in a limiting sense.

Various operations may be described as multiple discrete actions oroperations in turn, in a manner that is most helpful in understandingthe claimed subject matter. However, the order of description should notbe construed as to imply that these operations are necessarily orderdependent. In particular, these operations may not be performed in theorder of presentation. Operations described may be performed in adifferent order from the described embodiment. Various additionaloperations may be performed, and/or described operations may be omittedin additional embodiments.

For the purposes of the present disclosure, the phrase “A and/or B”means (A), (B), or (A and B). For the purposes of the presentdisclosure, the phrase “A, B, and/or C” means (A), (B), (C), (A and B),(A and C), (B and C), or (A, B, and C). The drawings are not necessarilyto scale. Although many of the drawings illustrate rectilinearstructures with flat walls and right-angle corners, this is simply forease of illustration, and actual devices made using these techniqueswill exhibit rounded corners, surface roughness, and other features.

The description uses the phrases “in an embodiment” or “in embodiments,”which may each refer to one or more of the same or differentembodiments. Furthermore, the terms “comprising,” “including,” “having,”and the like, as used with respect to embodiments of the presentdisclosure, are synonymous. As used herein, a “package” and an “ICpackage” are synonymous. When used to describe a range of dimensions,the phrase “between X and Y” represents a range that includes X and Y.

FIG. 1 is a side, cross-sectional view of an IC structure 100 includingan inorganic die 101 with organic interconnect layers 108, in accordancewith various embodiments.

An inorganic die 101 may include an inorganic substrate 102, and may, insome embodiments, include one or more device layers 106 and/or one ormore inorganic interconnect layers 120. For example, in the embodimentillustrated in FIG. 1, the inorganic die 101 includes a device layer 106proximate to one face (e.g., the “frontside”) of the inorganic substrate102, inorganic interconnect layers 120-1 proximate to that same face ofthe inorganic substrate 102 (such that the device layer 106 is betweenthe inorganic interconnect layers 120-1 and the inorganic substrate102), and organic interconnect layers 108 on the inorganic interconnectlayers 120-1 (such that the inorganic interconnect layers 120-1 arebetween the organic interconnect layers 108 and the device layer 106.Further, in the embodiment illustrated in FIG. 1, the inorganic die 101includes inorganic interconnect layers 120-2 proximate to the oppositeface (e.g., the “backside”) of the inorganic substrate 102 as theinorganic interconnect layers 120-1. In other embodiments, the devicelayer(s) 106 and/or the inorganic interconnect layer(s) 120 may beomitted; for example, FIGS. 2-4 illustrate IC structures 100 in which nodevice layer 106 or inorganic interconnect layers 120 are present. Someembodiments (not illustrated) of the IC structure 100 may include one ormore device layers 106 and one or more frontside inorganic interconnectlayers 120 without including any backside inorganic interconnect layers120. Some embodiments (not illustrated) of the IC structure 100 mayinclude no device layers 106 but may include one or more frontsideinorganic interconnect layers 120 and/or one or more backside inorganicinterconnect layers 120. More generally, an inorganic die 101 includingany desired combination of device layer(s) 106 and frontside and/orbackside inorganic interconnect layers 120 may be used in an ICstructure 100.

The inorganic substrate 102 may include any suitable inorganic material.In some embodiments, the inorganic substrate 102 may be a semiconductorsubstrate composed of semiconductor material systems including, forexample, n-type or p-type materials systems (or a combination of both).The inorganic substrate 102 may include, for example, a crystallinesubstrate formed using a bulk silicon or a silicon-on-insulator (SOI)substructure. In some embodiments, the inorganic substrate 102 may beformed using alternative materials, which may or may not be combinedwith silicon, that include but are not limited to germanium, indiumantimonide, lead telluride, indium arsenide, indium phosphide, galliumnitride, gallium arsenide, gallium nitride, or gallium antimonide.Further materials classified as group II-VI, III-V, or IV may also beincluded in the inorganic substrate 102. In some embodiments, theinorganic substrate 102 may include glass, diamond, sapphire, or aceramic material. In RF applications, as discussed further below, theinorganic substrate 102 may advantageously include glass or silicon. Asdiscussed further below, the inorganic substrate 102 may be part of asingulated die (e.g., the dies 1502 of FIG. 34) or a wafer (e.g., thewafer 1500 of FIG. 34).

Through-substrate vias (TSVs) 104 may extend through the inorganicsubstrate 102, providing electrical pathways across the inorganicsubstrate 102. The TSVs 104 may include an electrically conductivematerial (e.g., a metal) and may make contact with electricallyconductive structures at opposite faces of the inorganic substrate 102.In some embodiments, no TSVs 104 may be present (e.g., as discussedbelow with reference to FIG. 4).

When present in an inorganic die 101, a device layer 106 may include oneor more transistors (e.g., metal oxide semiconductor field-effecttransistors (MOSFETs)), one or more diodes, or other suitable devices.For example, a device layer 106 may include transistors having sourceand/or drain (S/D) regions, a gate to control current flow in thetransistors between the S/D regions, and one or more S/D contacts toroute electrical signals to/from the S/D regions. The transistors mayfurther include additional features, such as device isolation regions,gate contacts, and the like. The transistors in a device layer 106 mayinclude any desired type of transistors, such as planar transistors,non-planar transistors, or a combination of both. Planar transistors mayinclude bipolar junction transistors (BJT), heterojunction bipolartransistors (HBT), or high-electron-mobility transistors (HEMT).Non-planar transistors may include FinFET transistors, such asdouble-gate transistors or tri-gate transistors, and wrap-around orall-around gate transistors, such as nanoribbon and nanowiretransistors.

The gate of a transistor in a device layer 106 may include at least twolayers: a gate dielectric and a gate electrode. The gate dielectric mayinclude one layer or a stack of layers. The one or more layers mayinclude silicon oxide, silicon dioxide, silicon carbide, and/or a high-kdielectric material. The high-k dielectric material may include elementssuch as hafnium, silicon, oxygen, titanium, tantalum, lanthanum,aluminum, zirconium, barium, strontium, yttrium, lead, scandium,niobium, and zinc. Examples of high-k materials that may be used in thegate dielectric include, but are not limited to, hafnium oxide, hafniumsilicon oxide, lanthanum oxide, lanthanum aluminum oxide, zirconiumoxide, zirconium silicon oxide, tantalum oxide, titanium oxide, bariumstrontium titanium oxide, barium titanium oxide, strontium titaniumoxide, yttrium oxide, aluminum oxide, lead scandium tantalum oxide, andlead zinc niobate. In some embodiments, an annealing process may becarried out on the gate dielectric to improve its quality when a high-kmaterial is used.

The gate electrode may be formed on the gate dielectric and may includeat least one p-type work function metal or n-type work function metal,depending on whether the transistor is to be a p-type metal oxidesemiconductor (PMOS) or an n-type metal oxide semiconductor (NMOS)transistor. In some implementations, the gate electrode may consist of astack of two or more metal layers, where one or more metal layers arework function metal layers and at least one metal layer is a fill metallayer. Further metal layers may be included for other purposes, such asa barrier layer. For a PMOS transistor, metals that may be used for thegate electrode include, but are not limited to, ruthenium, palladium,platinum, cobalt, nickel, conductive metal oxides (e.g., rutheniumoxide), and any of the metals discussed below with reference to an NMOStransistor (e.g., for work function tuning). For an NMOS transistor,metals that may be used for the gate electrode include, but are notlimited to, hafnium, zirconium, titanium, tantalum, aluminum, alloys ofthese metals, carbides of these metals (e.g., hafnium carbide, zirconiumcarbide, titanium carbide, tantalum carbide, and aluminum carbide), andany of the metals discussed above with reference to a PMOS transistor(e.g., for work function tuning).

In some embodiments, when viewed as a cross-section of the transistoralong the source-channel-drain direction, the gate electrode may consistof a U-shaped structure that includes a bottom portion substantiallyparallel to the surface of the substrate and two sidewall portions thatare substantially perpendicular to the top surface of the substrate. Inother embodiments, at least one of the metal layers that form the gateelectrode may simply be a planar layer that is substantially parallel tothe top surface of the substrate and does not include sidewall portionssubstantially perpendicular to the top surface of the substrate. Inother embodiments, the gate electrode may consist of a combination ofU-shaped structures and planar, non-U-shaped structures. For example,the gate electrode may consist of one or more U-shaped metal layersformed atop one or more planar, non-U-shaped layers.

In some embodiments, a pair of sidewall spacers may be formed onopposing sides of the gate stack to bracket the gate stack. The sidewallspacers may be formed from materials such as silicon nitride, siliconoxide, silicon carbide, silicon nitride doped with carbon, and siliconoxynitride. Processes for forming sidewall spacers are well known in theart and generally include deposition and etching process steps. In someembodiments, a plurality of spacer pairs may be used; for instance, twopairs, three pairs, or four pairs of sidewall spacers may be formed onopposing sides of the gate stack.

The S/D regions may be proximate to the gate of each transistor. The S/Dregions may be formed using an implantation/diffusion process or anetching/deposition process, for example. In the former process, dopantssuch as boron, aluminum, antimony, phosphorous, or arsenic may beion-implanted into a substrate to form the S/D regions. An annealingprocess that activates the dopants and causes them to diffuse fartherinto the substrate may follow the ion-implantation process. In thelatter process, a substrate may first be etched to form recesses at thelocations of the S/D regions. An epitaxial deposition process may thenbe carried out to fill the recesses with material that is used tofabricate the S/D regions. In some implementations, the S/D regions maybe fabricated using a silicon alloy such as silicon germanium or siliconcarbide. In some embodiments, the epitaxially deposited silicon alloymay be doped in situ with dopants such as boron, arsenic, orphosphorous. In some embodiments, the S/D regions may be formed usingone or more alternate semiconductor materials such as germanium or agroup III-V material or alloy. In further embodiments, one or morelayers of metal and/or metal alloys may be used to form the S/D regions.

As noted above, in some embodiments, an IC structure 100 may includefrontside inorganic interconnect layers 120-1 and/or backside inorganicinterconnect layers 120-2. Electrical signals, such as power and/orinput/output (I/O) signals, may be routed to and/or from the devices(e.g., the transistors and/or diodes) of the device layer 106, orotherwise to and/or from the inorganic die 101, through these inorganicinterconnect layers 120. For example, electrically conductive featuresof the device layer 106 (e.g., gate and S/D contacts) may beelectrically coupled to conductive pathways 124 through the inorganicinterconnect layers 120. A set of inorganic interconnect layers 120 mayalso be referred to as a metallization stack.

Conductive lines and/or vias may be arranged within the inorganicinterconnect layers 120 to route electrical signals along electricalpathways 124 according to a wide variety of designs. In particular, thearrangement is not limited to the particular configuration of conductivelines and vias depicted in FIG. 1 or any of the other accompanyingdrawings.

Lines and vias in the inorganic interconnect layers 120 may include anelectrically conductive material such as a metal. The lines may bearranged to route electrical signals in a direction of a plane that issubstantially parallel with a surface of the inorganic substrate 102.For example, the lines may route electrical signals in a direction inand out of the page from the perspective of FIG. 1. The vias may bearranged to route electrical signals in a direction of a plane that issubstantially perpendicular to the surface of the inorganic substrate102. In some embodiments, the vias may electrically couple lines ofdifferent inorganic interconnect layers 120 together.

The inorganic interconnect layers 120 may include an inorganicdielectric material 122 disposed between the lines and vias, as shown inFIG. 1. In some embodiments, the inorganic dielectric material 122disposed between the lines and vias in different ones of the inorganicinterconnect layers 120 may have different compositions; in otherembodiments, the composition of the inorganic dielectric material 122 ofdifferent inorganic interconnect layers 120 may be the same.

Although the lines and the vias of the inorganic interconnect layers 120are structurally delineated with a line within each inorganicinterconnect layer 120 for the sake of clarity, the lines and the viasmay be structurally and/or materially contiguous (e.g., simultaneouslyfilled during a dual-damascene process) in some embodiments. In someembodiments, the thickness of the individual inorganic interconnectlayers 120 may increase with the distance from the inorganic substrate102 (e.g., the frontside inorganic interconnect layers 120-1 mayincrease in thickness closer to the front face 142, and the backsideinorganic interconnect layers 120-2 may increase in thickness closer tothe back face 144).

Organic interconnect layers 108 may be disposed at a face of theinorganic die 101. The organic interconnect layers 108 may include anorganic dielectric material 110 and electrical pathways 112 through theorganic dielectric material 110; the electrical pathways 112 may includeconductive lines and/or vias embedded in the organic dielectric material110, and vias may electrically couple lines in different ones of theorganic interconnect layers 108, as discussed above with reference tothe inorganic interconnect layers 120. Examples of organic dielectricmaterials 110 may include organic build-up films (e.g., including anorganic matrix with an inorganic particle filler, such as silica-filledepoxides), polyimides with or without filler, benzocyclobutene polymers,or unfilled epoxides. Although a particular number of organicinterconnect layers 108 (i.e., three) is depicted in FIG. 1 and othersof the accompanying drawings, an IC structure 100 may include anydesired number of organic interconnect layers 108. In some embodiments,for example, an IC structure 100 may include between two and eightorganic interconnect layers 108.

In some embodiments, the organic dielectric material 110 included in anorganic interconnect layer 108 may have a relatively low loss tangent(e.g., less than 0.01, less than 0.006, less than 0.004, or less than0.001). Organic dielectric materials 110 with low loss tangents may beparticularly useful when the IC structure 100 is part of an RF device, anumber of examples of which are discussed herein; relatively thicklayers of such organic dielectric materials 110 (e.g., havingthicknesses between 10 microns and 60 microns) may be used withoutcompromising RF performance, allowing thicker metallization (e.g., metallines having a thickness between 5 microns and 35 microns), and thuslower resistance, in each organic interconnect layer 108 relative toembodiments in which lossier organic dielectric materials 110 are used.Unlike the inorganic interconnect layers 120, the thicknesses of theindividual organic interconnect layers 108 may not necessarily increasewith the distance from the inorganic substrate 102; in some embodiments,an organic interconnect layer 108 farther from the inorganic substrate102 may be thinner than an organic interconnect layer 108 closer to theinorganic substrate 102. Different ones of the organic interconnectlayers 108 may have different thicknesses. In some embodiments, theorganic dielectric material 110 may not be photodefinable; instead, theorganic interconnect layers 108 may be built up by depositing a layer ofconductive material (e.g., metal), performing a lithographic operationto pattern the metal into vias, depositing the organic dielectricmaterial 110, and then performing a via reveal operation.

In some embodiments, the organic dielectric material 110 included in anorganic interconnect layer 108 may have a relatively low coefficient ofthermal expansion (CTE) (e.g., below 20 parts per million per degreeCelsius). The CTEs of such low-CTE organic dielectric materials 110 aregenerally closer to the CTE of the materials that may be included in theinorganic die 101 (e.g., as the inorganic substrate 102), and thus ICstructures 100 including low-CTE organic dielectric materials 110 mayexhibit reduced mechanical stress (and thus greater reliability duringoperation) at the interface between the organic interconnect layers 108and the inorganic die 101 relative to embodiments in which organicdielectric materials 110 with higher CTEs are used.

The IC structure 100 of FIG. 1 also includes one or more passivecomponents 146 integrally formed in the organic interconnect layers 108.In some embodiments, the passive components 146 may include one or moreinductors, as shown in FIG. 1, which may be particularly advantageous inRF settings. Inductors and other passive components 146 (e.g.,capacitors and/or resistors) may be formed in the organic interconnectlayers 108 using a lithographic via process, as known in the art, andmay be electrically connected to electrical pathways 112 in the organicinterconnect layers 108 so that the passive components 146 may be partof circuitry implemented by the IC structure 100. Any of the ICstructures 100 disclosed herein may include any desired number andarrangement of passive components 146 in the organic interconnect layers108. Although FIG. 1 illustrates a particular arrangement of inductorsin particular ones of the organic interconnect layers 108, any inductoror other passive component 146 formed integrally with the organicinterconnect layers 108 may be positioned as desired in any one or moreof the organic interconnect layers 108. In some embodiments of the ICstructures 100 disclosed herein, no passive components 146 may beintegrated into the organic interconnect layers 108.

The IC structure 100 may include a solder resist material 116 (e.g.,polyimide or similar material) and one or more conductive contacts 115on the organic interconnect layers 108. As used herein, a “conductivecontact” may refer to a portion of conductive material (e.g., metal)serving as an interface between different components; conductivecontacts may be recessed in, flush with, or extending away from asurface of a component, and may take any suitable form (e.g., aconductive pad or socket). In FIG. 1, the conductive contacts 115 areillustrated as taking the form of bond pads. The conductive contacts 115may be electrically coupled with the electrical pathways 112 of theorganic interconnect layers 108 and may route the electrical signals ofthe device layer 106 and/or other electrical signals (e.g., electricalsignals received at the conductive contacts 126) to other externaldevices. For example, solder 118 may be deposited on the one or moreconductive contacts 115 to mechanically and/or electrically couple theIC structure 100 with another component at the front face 142 (e.g.,another chip). The IC structure 100 may include additional or alternatestructures to route the electrical signals to/from the organicinterconnect layers 108; for example, the conductive contacts 115 mayinclude other analogous features (e.g., posts) that route the electricalsignals to/from external components. In some embodiments, the solderresist material 116 may be photodefinable (and thus may be directlypatterned).

In some embodiments, the IC structure 100 may include one or moreconductive contacts 126 on the back face 144 of the IC structure 100. Insome embodiments, a solder resist material (not shown) may also bepresent. In FIG. 1, the conductive contacts 126 are illustrated astaking the form of pillars (e.g., copper pillars). The conductivecontacts 126 may be electrically coupled with the electrical pathways124-2 of the backside inorganic interconnect layers 120-2 (when thebackside inorganic interconnect layers 120-2 are present) or the TSVs104 (when the backside inorganic interconnect layers 120-2 are notpresent) and may route the electrical signals of the device layer 106and/or other electrical signals (e.g., electrical signals received atthe conductive contacts 115) to other external devices. For example,solder bumps 128 may be formed on the one or more conductive contacts126 to mechanically and/or electrically couple the IC structure 100 withanother component at the back face 144 (e.g., another chip). The ICstructure 100 may include additional or alternate structures to routethe electrical signals to/from the back face 144; for example, theconductive contacts 126 may include other analogous features (e.g., bondpads) that route the electrical signals to/from external components.

As noted above, FIGS. 2-4 illustrate embodiments of the IC structure 100that do not include a device layer 106 or inorganic interconnect layers120. In FIG. 2, the IC structure 100 includes backside conductivecontacts 126 that are in electrical contact with the TSVs 104, which arein turn in electrical contact with the electrical pathways 112 of theorganic interconnect layers 108. The inorganic substrate 102 exposed atthe back face 144 of the IC structure 100 of FIG. 2 presents theopportunity to use the exposed inorganic substrate 102 as part of ahermetic seal, and thus the IC structure 100 of FIG. 2 may beparticularly advantageous as a hermetic lid on a resonator component(e.g., as discussed below with reference to the lidded resonatorassemblies 164 of FIGS. 17-21).

The IC structure 100 of FIG. 3 is similar to that of FIG. 2, but doesnot include any passive components 146. In an RF setting, passivecomponents (such as inductors, capacitors, and/or resistors) may besurface-mounted to the conductive contacts 115 at the front face 142 ofthe IC structure 100 via the solder 118, or may be otherwiseelectrically coupled to the IC structure 100 as desired. Like the ICstructure 100 of FIG. 2, the inorganic substrate 102 exposed at the backface 144 of the IC structure 100 of FIG. 3 presents the opportunity touse the exposed inorganic substrate 102 as part of a hermetic seal, andthus the IC structure 100 of FIG. 3 may be particularly advantageous asa hermetic lid on a resonator component (e.g., as discussed below withreference to the lidded resonator assemblies 164 of FIGS. 17-21).

The structure 100 of FIG. 4 is also similar to that of FIG. 2, but doesnot include any TSVs 104 and does include a barrier material 136 betweenthe inorganic substrate 102 and the organic interconnect layers 108. Thebarrier material 136 may be selected to limit diffusion between theinorganic substrate 102 and the organic dielectric material 110; forexample, when the inorganic substrate 102 includes silicon, the barriermaterial 136 may include silicon nitride. An IC structure 100 like thatof FIG. 4 may be particularly advantageous as an interposer (e.g., anembedded interposer in an organic package substrate) between differentRF dies or other electronic components coupled to the front face 142;when low-loss organic dielectric materials 110 are utilized in theorganic interconnect layers 108, the IC structure 100 may providelow-loss electrical pathways between such dies.

The IC structures 100 disclosed herein may be manufactured using anysuitable technique. For example, FIGS. 5-11 illustrate stages in anexample process for manufacturing the IC structure 100 of FIG. 1, inaccordance with various embodiments. Although the operations of theprocess of FIGS. 5-11 are illustrated with reference to particularembodiments of the IC structures 100 disclosed herein, the process maybe used to form any suitable IC structures 100. Operations areillustrated once each and in a particular order in FIGS. 5-11, but theoperations may be reordered and/or repeated as desired (e.g., withdifferent operations performed in parallel when manufacturing multipleelectronic components simultaneously).

FIG. 5 is a side, cross-sectional view of an assembly 200 including aninorganic substrate 102, a device layer 106, and frontside inorganicinterconnect layers 120-1 including electrical pathways 124-1. Theassembly 200 may be manufactured using conventional microelectronicsfabrication techniques for forming a device layer and a metallizationstack thereon. As noted above, in some embodiments, the thicknesses ofthe frontside inorganic interconnect layers 120-1 may increase fartherfrom the inorganic substrate 102.

FIG. 6 is a side, cross-sectional view of an assembly 202 subsequent toforming organic interconnect layers 108 on the frontside inorganicinterconnect layers 120-1 of the assembly 200 (FIG. 5). The organicinterconnect layers 108 may include electrical pathways 112, conductivecontacts 115, and passive components 146, as desired. In someembodiments, a lithographic via process may be used to form vias in theorganic interconnect layers 108 (and also pattern any suitablestructures of the passive components 146). As noted above, in someembodiments, the thicknesses of the organic interconnect layers 108 maynot necessarily increase farther from the inorganic substrate 102. Inembodiments in which the frontside inorganic interconnect layers 120-1and/or the device layer 106 are not to be included in the IC structure100, the operations of FIG. 6 may be performed directly on the inorganicsubstrate 102 (e.g., as illustrated in FIGS. 2 and 3) or on a barriermaterial 136 on an inorganic substrate 102 (e.g., as illustrated in FIG.4).

FIG. 7 is a side, cross-sectional view of an assembly 204 subsequent todepositing a solder resist material 116 on the organic interconnectlayers 108 of the assembly 202 (FIG. 6). In some embodiments, the solderresist material 116 may be laminated, sprayed, or otherwise deposited.

FIG. 8 is a side, cross-sectional view of an assembly 206 subsequent toforming openings in the solder resist material 116 of the assembly 204(FIG. 7) to expose the surfaces of the conductive contacts 115, anddepositing solder 118 in the openings in electrical contact with theconductive contacts 115.

FIG. 9 is a side, cross-sectional view of an assembly 208 subsequent toforming TSVs 104 through the inorganic substrate 102 of the assembly 206(FIG. 8). In some embodiments, the operations illustrated in FIGS. 9-11may be performed after “flipping” the assembly 206 (FIG. 8) so that theinorganic substrate 102 is facing “up”; such “flipping” operations areillustrated in FIGS. 5-11, but may be performed as desired. In someembodiments, the TSVs 104 may be formed by laser drilling holes throughthe inorganic substrate 102 to expose regions in the device layer 106,and then filling these holes with one or more conductive materials sothat the TSVs 104 are in electrical contact with the exposed regions ofthe device layer 106. In some embodiments, the TSVs 104 may have atapered shape, narrowing towards the front face 142 of the IC structure100 as a consequence of the laser drilling. In embodiments in which theIC structure 100 does not include the TSVs 104 (e.g., the IC structure100 of FIG. 4), the operations discussed with reference to FIGS. 9-11may not be performed.

FIG. 10 is a side, cross-sectional view of an assembly 210 subsequent toforming the backside inorganic interconnect layers 120-2 on theinorganic substrate 102 of the assembly 208 (FIG. 9). The backsideinorganic interconnect layers 120-2 may be formed using any of thetechniques used to form the frontside inorganic interconnect layers120-1. The backside inorganic interconnect layers 120-2 may includeconductive pathways 124-2, some of which may be in electrical contactwith the TSVs 104. In embodiments in which the IC structure 100 does notinclude backside inorganic interconnect layers 120-2 (e.g., the ICstructures 100 of FIGS. 2 and 3), the operations discussed withreference to FIG. 10 may not be performed.

FIG. 11 is a side, cross-sectional view of an assembly 212 subsequent toforming the conductive contacts 126 on the backside inorganicinterconnect layers 120-2 of the assembly 210 (FIG. 10), then providingsolder 128 on the conductive contacts 126. The assembly 212 may take theform of the IC structure 100 of FIG. 1. In some embodiments, theoperations of FIGS. 5-11 may begin with an assembly that includesrepeating units of the assembly 200 of FIG. 5, and the assemblies ofFIGS. 6-11 may likewise include repeating units of those depicted; uponcompletion, these repeating units may be singulated from each other,yielding individual IC structures 100. In some embodiments, thissingulation may take place after additional components are coupled tothe IC structures 100, as discussed below with reference to FIGS. 13-15.

As noted above, various components may be coupled to the front face 142of an IC structure 100 and/or the back face 144 of an IC structure 100.For example, FIG. 12 illustrates an IC assembly 150 including acomponent 138 electrically and mechanically coupled to the IC structure100 via the solder 118 on the conductive contacts 115 at the front face142. In some embodiments, the component 138 may take the form of any ofthe embodiments of the RF circuitry dies 166 disclosed herein, or mayinclude any other suitable die or other IC. Although the IC assembly 150illustrated in FIG. 12 includes the particular IC structure 100 of FIG.1 coupled to a single component 138, IC assemblies 150 may include anyof the IC structures 100 disclosed herein (e.g., IC structures 100 thatdo or do not include a device layer 106, IC structures 100 that do or donot include backside inorganic interconnect layers 120-2, IC structures100 that do or do not include the TSVs 104, etc.) with any number andarrangement of components 138 coupled thereto.

An IC assembly 150 may be manufactured using any suitable techniques.FIGS. 13-15 illustrate stages in an example process of manufacturing theIC assembly 150 of FIG. 12, in accordance with various embodiments.Although the operations of the process of FIGS. 13-15 are illustratedwith reference to particular embodiments of the IC assemblies 150disclosed herein, the process may be used to form any suitable ICassembly 150. Operations are illustrated once each and in a particularorder in FIGS. 13-15, but the operations may be reordered and/orrepeated as desired (e.g., with different operations performed inparallel when manufacturing multiple electronic componentssimultaneously).

FIG. 13 is a side, cross-sectional view of an assembly 214 that has theform of repeated units of the assembly 212 (FIG. 11); such an assemblymay be manufactured as discussed above with reference to FIGS. 5-11.

FIG. 14 is a side, cross-sectional view of an assembly 216 subsequent tocoupling components 138 to the conductive contacts 115 at the front face142 of the assembly 214 (FIG. 13), and then depositing a mold compound140 around the components 138. In some embodiments, an underfillmaterial different from the mold compound 140 may be deposited betweenthe components 138 and the front face 142. Example materials that may beused for the mold compound 140 and the underfill material (not shown)include epoxy matrices with filler particles of inorganic material suchas silica, alumina, etc.

FIG. 15 is a side, cross-sectional view of an assembly 218 subsequent tosingulating the assembly 216 (FIG. 14) to separate the assembly 216 intomultiple IC assemblies 150. Any suitable technique may be used tosingulate the assembly 216, such as sawing. In some embodiments, priorto singulation, the mold compound 140 may be polished away to expose the“top” surface of the components 138.

As noted above, embodiments in which the inorganic substrate 102 isexposed at the back face 144 of the IC structure 100 may be particularlyadvantageous when a hermetic coupling to another component is desired.For example, FIG. 16 is a “bottom” view of a back face 144 of an ICstructure 100 in which one of the conductive contacts 126, on theinorganic substrate 102, has a ring shape, in accordance with variousembodiments. The ring-shaped conductive contact 126 may or may not becoupled to any electrical pathways in the IC structure 100; instead, thering-shaped conductive contact 126 (e.g., a copper ring) may be used toform a hermetic seal with another component, as discussed below withreference to FIG. 17. In some embodiments, the IC structure 100 mayinclude a ring on the inorganic substrate 102 at the back face 144, butthis ring may not be conductive, and may instead be formed of anon-conductive material with which a hermetic seal may be made. The ICstructure 100 of FIG. 16 may or may not have a device layer 106,frontside inorganic interconnect layers 120, and/or a barrier material136, as desired.

FIG. 17 is a side, cross-sectional view of a lidded resonator assembly164 including an IC structure 100 like that of FIG. 16, in accordancewith various embodiments. The lidded resonator assembly 164 includes aresonator component 148 coupled to an IC structure 100 having aring-shaped conductive contact 126-1 on the inorganic substrate 102 atthe back face 144, as discussed above with reference to FIG. 16.Although FIG. 17 illustrates a particular IC structure 100 without adevice layer 106 or frontside inorganic interconnect layers 120, otherembodiments of the lidded resonator assembly 164 may include one or moreof such features, or additional features as desired.

The resonator component 148 may include a base 154, one or moreresonators 156 (e.g., one or more acoustic wave resonators (AWRs, suchas surface AWRs) or any other suitable type of resonator) coupled to thebase 154, and side walls 158. A ring-shaped conductive contact 162-1(e.g., a copper ring) on the side walls 158 may be coupled to thering-shaped conductive contact 126-1 of the IC structure 100 by asimilarly ring-shaped portion of solder 128 so that the IC structure 100provides a “lid” on the resonator component 148. In particular, thecoupling between the ring-shaped conductive contact 162-1 and thering-shaped conductive contact 126-1 may define a hermetically sealedcavity 160 into which one or more resonators 156 extend. The cavity 160may be under vacuum, or may include a gas (e.g., air, nitrogen, etc.) toreduce or control damping of the resonators 156. In some embodiments,the resonators 156 may include a piezoelectric material, and thusmechanical deformation of the resonators 156 may be associated with thegeneration of electrical signals. In particular, the frequency ofresonance of the resonators 156 may be desirably located at the centerof the passband for each supported frequency band. Further conductivecontacts 162-2 of the resonator component 148 may be coupled to otherones of the conductive contacts 126-2 of the IC structure 100, and maybe part of electrical pathways 149 between the IC structure 100 and theresonators 156 through the resonator component 148.

The dimensions of the resonator component 148 may take any suitablevalues. In some embodiments, the height of the resonator component 148may be between 50 microns and 500 microns. In some embodiments, a liddedresonator assembly 164 may include one or more resonator components 148coupled to the IC structure 100. A lidded resonator assembly 164 withmultiple resonator components 148 may be particularly useful whenresonators 156 of different thicknesses are to be used; in some suchembodiments, resonator components 148 having resonators 156 of differentthicknesses may be manufactured separately (e.g., on separate wafers)and then multiple ones of the resonator components 148 may be coupled toa common IC structure 100. In some embodiments, a lidded resonatorassembly 164 may include multiple IC structures 100 each coupled to oneor more resonator components 148; in some such embodiments, a moldcompound or other material may allow the multiple IC structures 100(with attached resonator components 148) to be treated as a single,integral lidded resonator assembly 164.

Lidded resonator assemblies 164, including an IC structure 100 asdiscussed above, may be particularly useful in RF applications. Forexample, FIGS. 18-21 are side, cross-sectional views of example RFfront-end (FE) modules 180 including lidded resonator assemblies 164(e.g., the lidded resonator assembly 164 of FIG. 17), in accordance withvarious embodiments. The RF FE modules 180 of FIGS. 18-21 all include anRF circuitry die 166 electrically coupled to a lidded resonator assembly164. Although the RF FE modules 180 of FIGS. 18-21 depict a single RFcircuitry die 166 and a single lidded resonator assembly 164, this issimply for ease of illustration, and any of the RF FE modules 180disclosed herein may include multiple RF circuitry dies 166 (e.g.,coupled to the lidded resonator assembly 164 in a 2D, 2.5D, or 3Dfashion) and/or multiple lidded resonator assemblies 164. The RFcircuitry dies 166 included in an RF FE module 180 may include circuitryto support RF FE operation, such as one or more power amplifiers (PAs),one or more switches, driver circuitry, and/or one or more matchingnetworks. The RF circuitry dies 166 may be packaged in any desiredmanner, or unpackaged, as desired. Additional components, such assurface-mounted passive components, may also be included in an RF FEmodule 180. The RF FE modules 180 of FIGS. 18-21 all include conductivecontacts 174 which may be used to couple the RF FE module 180 to anothercomponent (e.g., a circuit board, such as a motherboard, an interposer,or another IC package, etc.). In some embodiments, the interconnects incontact with the conductive contacts 174 may be second-levelinterconnects. The conductive contacts 174 illustrated in FIGS. 18-21are shown as coupled to solder bumps 176 (e.g., for a ball grid arrayarrangement), but any suitable second-level interconnects may be used(e.g., pins in a pin grid array arrangement or lands in a land gridarray arrangement).

The RF FE module 180 of FIG. 18 includes an organic package substrate168 having a first face 170 and the second face 172. One or more RFcircuitry dies 166 may be electrically and mechanically coupled to thesecond face 172 (e.g., via solder, as shown), and a lidded resonatorassembly 164 (including a resonator component 148 hermetically coupledto the back face 144 of an IC structure 100, as shown) may beelectrically and mechanically coupled to the first face 170. In someembodiments, conductive contacts 115 at the front face 142 of the ICstructure 100 of the lidded resonator assembly 164 may be coupled toconductive contacts at the first face 170 of the organic packagesubstrate 168 via solder 118, as shown. An underfill material 178 may bedisposed between the organic package substrate 168 and the RF circuitrydie 166, and/or between the IC structure 100 of the lidded resonatorassembly 164 and the organic package substrate 168. The organic packagesubstrate 168 may include one or more layers of organic dielectricmaterial with conductive pathways therethrough, and may includeelectrical pathways (not shown) between the lidded resonator assembly164 and the RF circuitry die 166. In some embodiments, the organicpackage substrate 168 may be formed using printed circuit board (PCB)manufacturing processes. In some embodiments, the organic packagesubstrate 168 may include inorganic bridges (e.g., embedded multi-chipinterconnect bridges) to couple multiple ones of the RF circuitry dies166 at the second face 172 (when present), waveguide interconnects, orother interconnects as suitable. The organic package substrate 168 mayalso include integrated passive devices, such as inductors, as desired,and other discrete passive devices may be coupled (e.g.,surface-mounted) to a face of the organic package substrate 168. Theconductive contacts 174 may be located at the first face 170 of theorganic package substrate 168, and the solder bumps 176 may be formed tobe tall enough to permit attachment of the RF FE module 180 to anothercomponent via the solder bumps 176 while leaving room for the liddedresonator assembly 164. Of the RF FE modules 180 of FIGS. 18-21, the RFFE module 180 may be the least expensive to manufacture and may involvethe least complex manufacturing operations, but may also have thelargest form factor and may exhibit the greatest losses (e.g., due tothe relatively lossy dielectric material that may be included in theorganic package substrate 168).

The RF FE module 180 of FIG. 19 shares some characteristics with FIG.18, but does not include an organic package substrate 168. Instead, thelidded resonator assembly 164 is electrically and mechanically coupledto a face of the RF circuitry die 166 directly. In particular,conductive contacts 115 at the front face 142 of the IC structure 100 ofthe lidded resonator assembly 164 may be coupled to conductive contactsat the face of the RF circuitry die 166. An underfill material 178 maybe disposed between the IC structure 100 of the lidded resonatorassembly 164 and the RF circuitry die 166. Conductive contacts 174 maybe located at the same face of the RF circuitry die 166, and the solderbumps 176 may be formed to be tall enough to permit attachment of the RFFE module 180 to another component via the solder bumps 176 whileleaving room for the lidded resonator assembly 164. Because the RF FEmodule 180 of FIG. 19 does not include an organic package substrate(like the organic package substrate 168 of the RF FE module 180 of FIG.18), the RF FE module 180 of FIG. 19 may include more organicinterconnect layers 108 in the IC structure 100 of the lidded resonatorassembly 164 to achieve a desired amount of routing relative to the RFFE module 180 of FIG. 18, but may be more compact in height (andpossibly in lateral directions) than the RF FE module 180 of FIG. 18.However, a larger RF circuitry die 166 may be required in the embodimentof FIG. 19 relative to the embodiment of FIG. 18, which may increasecosts, and the use of sufficiently tall solder bumps 176 may addcomplexity to the manufacturing of the RF FE module 180 of FIG. 19.

The RF FE module 180 of FIG. 20 shares some characteristics with FIG.19, but includes a mold compound 140 disposed around the liddedresonator assembly 164 and the RF circuitry die 166, with through-moldvias (TMVs) 184 extending through the mold compound 140 to makeelectrical contact with conductive contacts (not shown) of the RFcircuitry die 166. The exposed surfaces of the TMVs 184 may serve as theconductive contacts 174; solder bumps 176 may be disposed on theseconductive contacts 174, and may be used to permit attachment of the RFFE module 180 to another component via the solder bumps 176. Because theRF FE module 180 of FIG. 20 does not include an organic packagesubstrate (like the organic package substrate 168 of the RF FE module180 of FIG. 18), the RF FE module 180 of FIG. 20 may include moreorganic interconnect layers 108 in the IC structure 100 of the liddedresonator assembly 164 to achieve a desired amount of routing relativeto the RF FE module 180 of FIG. 18, but may be more compact in height(and possibly in lateral directions) than the RF FE module 180 of FIG.18. However, a larger RF circuitry die 166 may be required in theembodiment of FIG. 19 relative to the embodiment of FIG. 18, which mayincrease costs. The embodiment of FIG. 20 may achieve a larger densityof connections to external components (via the TMVs 184/solder bumps176), allowing for more signaling, power, and/or ground connections tothe RF circuitry die 166 and thus to the lidded resonator assembly 164.

The RF FE module 180 of FIG. 21, like the RF FE modules 180 of FIGS.19-20, includes a lidded resonator assembly 164 electrically andmechanically coupled to a face of the RF circuitry die 166 directly. Inparticular, conductive contacts 115 at the front face 142 of the ICstructure 100 of the lidded resonator assembly 164 may be coupled toconductive contacts at the face of the RF circuitry die 166. In FIG. 21,however, the conductive contacts 174 are disposed at the back face 144of the IC structure 100; solder bumps 176 may be formed to be tallenough to permit attachment of the RF FE module 180 to another componentvia the solder bumps 176 while leaving room for the resonator component148 of the lidded resonator assembly 164. A mold compound 140 may bedisposed around the RF circuitry die 166 at the front face of the ICstructure 100; in other embodiments, an underfill material may bepresent instead of or in addition to a mold compound 140. Because the RFFE module 180 of FIG. 21 does not include an organic package substrate(like the organic package substrate 168 of the RF FE module 180 of FIG.18), the RF FE module 180 of FIG. 21 may include more organicinterconnect layers 108 in the IC structure 100 of the lidded resonatorassembly 164 to achieve a desired amount of routing relative to the RFFE module 180 of FIG. 18, but may be more compact in height (andpossibly in lateral directions) than the RF FE module 180 of FIG. 18.Further, a smaller RF circuitry die 166 may be utilized in theembodiment of FIG. 21 relative to the embodiments of FIGS. 19 and 20.Although a larger IC structure 100 may be required in the embodiment ofFIG. 21 relative to the embodiments of FIGS. 19-20, the costs ofmanufacturing the IC structure 100 may be less than the costs ofmanufacturing an equivalently sized RF circuitry die 166. The embodimentof FIG. 21 may also exhibit reduced manufacturing complexity relative tothe embodiment of FIG. 19 because “shorter” solder bumps 176 may beused. In some embodiments, an underfill material (not shown) may bepresent between the edges of the resonator component 148 and the ICstructure 100 to provide mechanical support to the resonator component148; such an “edge glue” may be included in any of the lidded resonatorassemblies 164 disclosed herein.

The RF FE modules 180 of FIGS. 18-21 may be manufactured using anysuitable techniques. For example, FIGS. 22-25 illustrate stages in anexample process of manufacturing the RF FE module 180 of FIG. 18, inaccordance with various embodiments. Although the operations of theprocess of FIGS. 22-25 are illustrated with reference to particularembodiments of the RF FE modules 180 disclosed herein, the process maybe used to form any suitable RF FE module 180. Operations areillustrated once each and in a particular order in FIGS. 22-25, but theoperations may be reordered and/or repeated as desired (e.g., withdifferent operations performed in parallel when manufacturing multipleelectronic components simultaneously).

FIG. 22 is a side, cross-sectional view of an assembly 220 including thelidded resonator assembly 164 having solder 118 on the conductivecontacts 115 at the front face 142 of the IC structure 100. The assembly220 may be formed in accordance with any of the techniques disclosedherein.

FIG. 23 is a side, cross-sectional view of an assembly 222 including anRF circuitry die 166 coupled to the second face 172 of the organicpackage substrate 168, with an underfill material 178 therebetween. Theassembly 222 may be formed using any suitable packaging technique (e.g.,any suitable technique for forming first-level interconnects). In someembodiments, the underfill material 178 may be provided by capillaryaction, as known in the art.

FIG. 24 is a side, cross-sectional view of an assembly 224 subsequent tocoupling the assembly 220 (FIG. 22) to the assembly 222 (FIG. 23) sothat conductive contacts 115 of the IC structure 100 of the liddedresonator assembly 164 are coupled to conductive contacts at the firstface 170 of the organic package substrate 168 via the solder 118, andproviding an underfill material between the IC structure 100 and theorganic package substrate 168.

FIG. 25 is a side, cross-sectional view of an assembly 226 subsequent toforming the solder bumps 176 on the conductive contacts 174 at the firstface 170 of the organic package substrate 168. The assembly 226 may takethe form of the RF FE module 180 of FIG. 18. The RF FE module 180 ofFIG. 19 may be manufactured using a process similar to that illustratedin FIGS. 22-25, but omitting the organic package substrate 168 so thatthe lidded resonator assembly 164 is coupled directly to the RFcircuitry die 166.

FIGS. 26-29 illustrate stages in an example process of manufacturing theRF FE module 180 of FIG. 20, in accordance with various embodiments.Although the operations of the process of FIGS. 26-29 are illustratedwith reference to particular embodiments of the RF FE modules 180disclosed herein, the process may be used to form any suitable RF FEmodule 180. Operations are illustrated once each and in a particularorder in FIGS. 26-29, but the operations may be reordered and/orrepeated as desired (e.g., with different operations performed inparallel when manufacturing multiple electronic componentssimultaneously).

FIG. 26 is a side, cross-sectional view of an assembly 228 subsequent tocoupling the assembly 220 (FIG. 22) to an RF circuitry die 166. Inparticular, conductive contacts 115 of the IC structure 100 of thelidded resonator assembly 164 are coupled to conductive contacts at aface of the RF circuitry die 166 via the solder 118.

FIG. 27 is a side, cross-sectional view of an assembly 230 subsequent toproviding a mold compound 140 around the lidded resonator assembly 164of the assembly 228 (FIG. 26). In some embodiments, the mold compound140 may be planarized after deposition in order to expose the “bottom”face of the resonator component 148, as shown.

FIG. 28 is a side, cross-sectional view of an assembly 232 subsequent toforming cavities in the mold compound to expose conductive contacts (notshown) at a face of the RF circuitry die 166 of the assembly 230 (FIG.27) and then filling these cavities with conductive material to form theTMVs 184. In some embodiments, the TMVs 184 may have a tapered shape,narrowing towards the RF circuitry die 166. The exposed faces of theTMVs 184 may provide the conductive contacts 174.

FIG. 29 is a side, cross-sectional view of an assembly 234 subsequent toforming the solder bumps 176 on the conductive contacts 174 of theassembly 232 (FIG. 28). The assembly 234 may take the form of the RF FEmodule 180 of FIG. 20.

FIGS. 30-33 illustrate stages in an example process of manufacturing theRF FE module 180 of FIG. 21, in accordance with various embodiments.Although the operations of the process of FIGS. 30-33 are illustratedwith reference to particular embodiments of the RF FE modules 180disclosed herein, the process may be used to form any suitable RF FEmodule 180. Operations are illustrated once each and in a particularorder in FIGS. 30-33, but the operations may be reordered and/orrepeated as desired (e.g., with different operations performed inparallel when manufacturing multiple electronic componentssimultaneously).

FIG. 30 is a side, cross-sectional view of an assembly 236 including anIC structure 100 coupled to an RF circuitry die 166. In particular,conductive contacts 115 of the IC structure 100 are coupled toconductive contacts at a face of the RF circuitry die 166 via the solder118. In the embodiment illustrated in FIG. 30, the conductive contacts174 are at the back face 144 of the IC structure 100.

FIG. 31 is a side, cross-sectional view of an assembly 238 subsequent toproviding a mold compound 140 around the RF circuitry die 166 of theassembly 236 (FIG. 30). In some embodiments, the mold compound 140 maybe planarized after deposition in order to expose the “top” face of theRF circuitry die 166, as shown.

FIG. 32 is a side, cross-sectional view of an assembly 240 subsequent tocoupling a resonator component 148 to the back face 144 of the ICstructure 100 of the assembly 238 (FIG. 31) so that the resonatorcomponent 148 and the IC structure 100 together form a lidded resonatorassembly 164 (e.g., with a hermetic seal between the resonator component148 and the IC structure 100, as discussed above).

FIG. 33 is a side, cross-sectional view of an assembly 242 subsequent toforming the solder bumps 176, conductive contacts 174 of the assembly240 (FIG. 32). The assembly 242 may take the form of the RF FE module180 of FIG. 21.

The IC structures 100, IC assemblies 150, lidded resonator assemblies164, and/or RF FE modules 180 disclosed herein may include, or may beincluded in, any suitable electronic component. FIGS. 34-37 illustratevarious examples of apparatuses that may include, or be included in, anyof the IC structures 100, IC assemblies 150, lidded resonator assemblies164, and/or RF FE modules 180 disclosed herein, as appropriate.

FIG. 34 is a top view of a wafer 1500 and dies 1502 that may include oneor more IC structures 100, or may be included in any suitable ones ofthe IC assemblies 150, lidded resonator assemblies 164, and/or RF FEmodules 180 disclosed herein. The wafer 1500 may be composed of aninorganic material (e.g., a semiconductor material) and may include oneor more dies 1502 having structures formed on a surface of the wafer1500. Each of the dies 1502 may be a repeating unit of a product thatincludes any suitable circuitry. After the fabrication of the product iscomplete, the wafer 1500 may undergo a singulation process in which thedies 1502 are separated from one another to provide discrete “chips” ofthe semiconductor product. In some embodiments, the die 1502 may includeany of the IC structures 100 disclosed herein (e.g., the material of thewafer 1500 may be part of the inorganic substrate 102). In someembodiments, the wafer 1500 or the die 1502 may include a memory device(e.g., a random access memory (RAM) device, such as a static RAM (SRAM)device, a magnetic RAM (MRAM) device, a resistive RAM (RRAM) device, aconductive-bridging RAM (CBRAM) device, etc.), a logic device (e.g., anAND, OR, NAND, or NOR gate), or any other suitable circuit element.Multiple ones of these devices may be combined on a single die 1502. Forexample, a memory array formed by multiple memory devices may be formedon a same die 1502 as a processing device (e.g., the processing device1802 of FIG. 36) or other logic that is configured to store informationin the memory devices or execute instructions stored in the memoryarray.

FIG. 35 is a side, cross-sectional view of an IC device assembly 1700that may include any of the IC structures 100, IC assemblies 150, liddedresonator assemblies 164, and/or RF FE modules 180 disclosed herein. TheIC device assembly 1700 includes a number of components disposed on acircuit board 1702 (which may be, e.g., a motherboard). The IC deviceassembly 1700 includes components disposed on a first face 1740 of thecircuit board 1702 and an opposing second face 1742 of the circuit board1702; generally, components may be disposed on one or both faces 1740and 1742. Any of the IC packages discussed below with reference to theIC device assembly 1700 may take the form of any of the IC assemblies150, lidded resonator assemblies 164, and/or RF FE modules 180 disclosedherein.

In some embodiments, the circuit board 1702 may be a PCB includingmultiple metal layers separated from one another by layers of organicdielectric material and interconnected by electrically conductive vias.Any one or more of the metal layers may be formed in a desired circuitpattern to route electrical signals (optionally in conjunction withother metal layers) between the components coupled to the circuit board1702. In other embodiments, the circuit board 1702 may be a non-PCBsubstrate.

The IC device assembly 1700 illustrated in FIG. 35 includes apackage-on-interposer structure 1736 coupled to the first face 1740 ofthe circuit board 1702 by coupling components 1716. The couplingcomponents 1716 may electrically and mechanically couple thepackage-on-interposer structure 1736 to the circuit board 1702, and mayinclude solder balls (as shown in FIG. 35), male and female portions ofa socket, an adhesive, an underfill material, and/or any other suitableelectrical and/or mechanical coupling structure.

The package-on-interposer structure 1736 may include an IC package 1720coupled to an package interposer 1704 by coupling components 1718. Thecoupling components 1718 may take any suitable form for the application,such as the forms discussed above with reference to the couplingcomponents 1716. Although a single IC package 1720 is shown in FIG. 35,multiple IC packages may be coupled to the package interposer 1704;indeed, additional interposers may be coupled to the package interposer1704. The package interposer 1704 may provide an intervening substrateused to bridge the circuit board 1702 and the IC package 1720.Generally, the package interposer 1704 may spread a connection to awider pitch or reroute a connection to a different connection. Forexample, the package interposer 1704 may couple the IC package 1720 to aset of ball grid array conductive contacts of the coupling components1716 for coupling to the circuit board 1702. In the embodimentillustrated in FIG. 35, the IC package 1720 and the circuit board 1702are attached to opposing sides of the package interposer 1704; in otherembodiments, the IC package 1720 and the circuit board 1702 may beattached to a same side of the package interposer 1704. In someembodiments, three or more components may be interconnected by way ofthe package interposer 1704.

In some embodiments, the package interposer 1704 may be formed as a PCB,including multiple metal layers separated from one another by layers ofdielectric material and interconnected by electrically conductive vias.In some embodiments, the package interposer 1704 may be formed of anepoxy resin, a fiberglass-reinforced epoxy resin, an epoxy resin withinorganic fillers, a ceramic material, or a polymer material such aspolyimide. In some embodiments, the package interposer 1704 may beformed of alternate rigid or flexible materials that may include thesame materials described above for use in a semiconductor substrate,such as silicon, germanium, and other group III-V and group IVmaterials. The package interposer 1704 may include metal lines 1710 andvias 1708, including but not limited to TSVs 1706. The packageinterposer 1704 may further include embedded devices 1714, includingboth passive and active devices. Such devices may include, but are notlimited to, capacitors, decoupling capacitors, resistors, inductors,fuses, diodes, transformers, sensors, electrostatic discharge (ESD)devices, and memory devices. More complex devices such as RF devices,PAs, power management devices, antennas, arrays, sensors, andmicroelectromechanical systems (MEMS) devices may also be formed on thepackage interposer 1704. The package-on-interposer structure 1736 maytake the form of any of the package-on-interposer structures known inthe art.

The IC device assembly 1700 may include an IC package 1724 coupled tothe first face 1740 of the circuit board 1702 by coupling components1722. The coupling components 1722 may take the form of any of theembodiments discussed above with reference to the coupling components1716, and the IC package 1724 may take the form of any of theembodiments discussed above with reference to the IC package 1720.

The IC device assembly 1700 illustrated in FIG. 35 includes apackage-on-package structure 1734 coupled to the second face 1742 of thecircuit board 1702 by coupling components 1728. The package-on-packagestructure 1734 may include an IC package 1726 and an IC package 1732coupled together by coupling components 1730 such that the IC package1726 is disposed between the circuit board 1702 and the IC package 1732.The coupling components 1728 and 1730 may take the form of any of theembodiments of the coupling components 1716 discussed above, and the ICpackages 1726 and 1732 may take the form of any of the embodiments ofthe IC package 1720 discussed above. The package-on-package structure1734 may be configured in accordance with any of the package-on-packagestructures known in the art.

FIG. 36 is a block diagram of an example electrical device 1800 that mayinclude one or more IC structures 100, IC assemblies 150, liddedresonator assemblies 164, and/or RF FE modules 180, in accordance withany of the embodiments disclosed herein. For example, any suitable onesof the components of the electrical device 1800 may include one or moreof the IC device assemblies 1700 or dies 1502 disclosed herein. A numberof components are illustrated in FIG. 36 as included in the electricaldevice 1800, but any one or more of these components may be omitted orduplicated, as suitable for the application. In some embodiments, someor all of the components included in the electrical device 1800 may beattached to one or more motherboards. In some embodiments, some or allof these components are fabricated onto a single system-on-a-chip (SoC)die.

Additionally, in various embodiments, the electrical device 1800 may notinclude one or more of the components illustrated in FIG. 36, but theelectrical device 1800 may include interface circuitry for coupling tothe one or more components. For example, the electrical device 1800 maynot include a display device 1806, but may include display deviceinterface circuitry (e.g., a connector and driver circuitry) to which adisplay device 1806 may be coupled. In another set of examples, theelectrical device 1800 may not include an audio input device 1824 or anaudio output device 1808, but may include audio input or output deviceinterface circuitry (e.g., connectors and supporting circuitry) to whichan audio input device 1824 or audio output device 1808 may be coupled.

The electrical device 1800 may include a processing device 1802 (e.g.,one or more processing devices). As used herein, the term “processingdevice” or “processor” may refer to any device or portion of a devicethat processes electronic data from registers and/or memory to transformthat electronic data into other electronic data that may be stored inregisters and/or memory. The processing device 1802 may include one ormore digital signal processors (DSPs), application-specific ICs (ASICs),central processing units (CPUs), graphics processing units (GPUs),cryptoprocessors (specialized processors that execute cryptographicalgorithms within hardware), server processors, or any other suitableprocessing devices. The electrical device 1800 may include a memory1804, which may itself include one or more memory devices such asvolatile memory (e.g., dynamic random access memory (DRAM)), nonvolatilememory (e.g., read-only memory (ROM)), flash memory, solid state memory,and/or a hard drive. In some embodiments, the memory 1804 may includememory that shares a die with the processing device 1802. This memorymay be used as cache memory and may include embedded dynamic randomaccess memory (eDRAM) or spin transfer torque magnetic random accessmemory (STT-MRAM).

In some embodiments, the electrical device 1800 may includecommunication circuitry 1812. For example, the communication circuitry1812 may be configured for managing wireless communications for thetransfer of data to and from the electrical device 1800. The term“wireless” and its derivatives may be used to describe circuits,devices, systems, methods, techniques, communications channels, etc.,that may communicate data through the use of modulated electromagneticradiation through a nonsolid medium. The term does not imply that theassociated devices do not contain any wires, although in someembodiments they might not.

The communication circuitry 1812 may implement any of a number ofwireless standards or protocols, including but not limited to Institutefor Electrical and Electronic Engineers (IEEE) standards including Wi-Fi(IEEE 802.11 family), IEEE 802.16 standards (e.g., IEEE 802.16-2005Amendment), Long-Term Evolution (LTE) project along with any amendments,updates, and/or revisions (e.g., advanced LTE project, ultra mobilebroadband (UMB) project (also referred to as “3GPP2”), etc.). IEEE802.16 compatible Broadband Wireless Access (BWA) networks are generallyreferred to as WiMAX networks, an acronym that stands for WorldwideInteroperability for Microwave Access, which is a certification mark forproducts that pass conformity and interoperability tests for the IEEE802.16 standards. The communication circuitry 1812 may operate inaccordance with a Global System for Mobile Communication (GSM), GeneralPacket Radio Service (GPRS), Universal Mobile Telecommunications System(UMTS), High Speed Packet Access (HSPA), Evolved HSPA (E-HSPA), or LTEnetwork. The communication circuitry 1812 may operate in accordance withEnhanced Data for GSM Evolution (EDGE), GSM EDGE Radio Access Network(GERAN), Universal Terrestrial Radio Access Network (UTRAN), or EvolvedUTRAN (E-UTRAN). The communication circuitry 1812 may operate inaccordance with Code Division Multiple Access (CDMA), Time DivisionMultiple Access (TDMA), Digital Enhanced Cordless Telecommunications(DECT), Evolution-Data Optimized (EV-DO), and derivatives thereof, aswell as any other wireless protocols that are designated as 3G, 4G, 5G,and beyond. The communication circuitry 1812 may operate in accordancewith other wireless protocols in other embodiments. The electricaldevice 1800 may include an antenna 1822 to facilitate wirelesscommunications and/or to receive other wireless communications (such asAM or FM radio transmissions). The communication circuitry 1812 mayinclude any of the IC structures 100, IC assemblies 150, liddedresonator assemblies 164, and/or RF FE modules 180 disclosed herein.

In some embodiments, the communication circuitry 1812 may manage wiredcommunications, such as electrical, optical, or any other suitablecommunication protocols (e.g., the Ethernet). As noted above, thecommunication circuitry 1812 may include multiple communication chips.For instance, a first communication circuitry 1812 may be dedicated toshorter-range wireless communications such as Wi-Fi or Bluetooth, and asecond communication circuitry 1812 may be dedicated to longer-rangewireless communications such as global positioning system (GPS), EDGE,GPRS, CDMA, WiMAX, LTE, EV-DO, or others. In some embodiments, a firstcommunication circuitry 1812 may be dedicated to wirelesscommunications, and a second communication circuitry 1812 may bededicated to wired communications.

The electrical device 1800 may include battery/power circuitry 1814. Thebattery/power circuitry 1814 may include one or more energy storagedevices (e.g., batteries or capacitors) and/or circuitry for couplingcomponents of the electrical device 1800 to an energy source separatefrom the electrical device 1800 (e.g., AC line power).

The electrical device 1800 may include a display device 1806 (orcorresponding interface circuitry, as discussed above). The displaydevice 1806 may include any visual indicators, such as a heads-updisplay, a computer monitor, a projector, a touchscreen display, aliquid crystal display (LCD), a light-emitting diode display, or a flatpanel display.

The electrical device 1800 may include an audio output device 1808 (orcorresponding interface circuitry, as discussed above). The audio outputdevice 1808 may include any device that generates an audible indicator,such as speakers, headsets, or earbuds.

The electrical device 1800 may include an audio input device 1824 (orcorresponding interface circuitry, as discussed above). The audio inputdevice 1824 may include any device that generates a signalrepresentative of a sound, such as microphones, microphone arrays, ordigital instruments (e.g., instruments having a musical instrumentdigital interface (MIDI) output).

The electrical device 1800 may include a GPS device 1818 (orcorresponding interface circuitry, as discussed above). The GPS device1818 may be in communication with a satellite-based system and mayreceive a location of the electrical device 1800, as known in the art.

The electrical device 1800 may include an other output device 1810 (orcorresponding interface circuitry, as discussed above). Examples of theother output device 1810 may include an audio codec, a video codec, aprinter, a wired or wireless transmitter for providing information toother devices, or an additional storage device.

The electrical device 1800 may include an other input device 1820 (orcorresponding interface circuitry, as discussed above). Examples of theother input device 1820 may include an accelerometer, a gyroscope, acompass, an image capture device, a keyboard, a cursor control devicesuch as a mouse, a stylus, a touchpad, a bar code reader, a QuickResponse (QR) code reader, any sensor, or a radio frequencyidentification (RFID) reader.

The electrical device 1800 may have any desired form factor, such as ahandheld or mobile electrical device (e.g., a cell phone, a smart phone,a mobile internet device, a music player, a tablet computer, a laptopcomputer, a netbook computer, an ultrabook computer, a personal digitalassistant (PDA), an ultra mobile personal computer, etc.), a desktopelectrical device, a server device or other networked computingcomponent, a printer, a scanner, a monitor, a set-top box, anentertainment control unit, a vehicle control unit, a digital camera, adigital video recorder, or a wearable electrical device. In someembodiments, the electrical device 1800 may be any other electronicdevice that processes data.

FIG. 37 is a block diagram of an example RF device 2500 that may includeany of the IC structures 100, IC assemblies 150, lidded resonatorassemblies 164, and/or RF FE modules 180 disclosed herein. For example,any suitable ones of the components of the RF device 2500 may include,or may be included in, an IC assembly 150, a lidded resonator assembly164, and/or an RF FE module 180, in accordance with any of theembodiments disclosed herein. Any of the components of the RF device2500 may include, or be included in, an IC assembly 1700 as describedwith reference to FIG. 35. In some embodiments, the RF device 2500 maybe included within any components of the computing device 1800 asdescribed above with reference to FIG. 36 (e.g., the communicationcircuitry 1812), or may be coupled to any of the components of theelectrical device 1800 (e.g., may be coupled to the memory 1804 and/orto the processing device 1802 of the electrical device 1800). In stillother embodiments, the RF device 2500 may further include any of thecomponents described above with reference to FIG. 36, such as, but notlimited to, the battery/power circuitry 1814, the memory 1804, andvarious input and output devices as discussed above with reference toFIG. 46.

In general, the RF device 2500 may be any device or system that maysupport wireless transmission and/or reception of signals in the form ofelectromagnetic waves in the RF range of approximately 3 kiloHertz (kHz)to 300 gigaHertz (GHz). In some embodiments, the RF device 2500 may beused for wireless communications, e.g., in a base station (BS) or a userequipment (UE) device of any suitable cellular wireless communicationstechnology, such as GSM, WCDMA, or LTE. In a further example, the RFdevice 2500 may be used as, or in, a BS or a UE device of amillimeter-wave wireless technology such as fifth generation (5G)wireless (e.g., high-frequency/short wavelength spectrum, withfrequencies in the range between about 20 GHz and 60 GHz, correspondingto wavelengths in the range between about 5 millimeters and 15millimeters). In yet another example, the RF device 2500 may be used forwireless communications using Wi-Fi technology (e.g., a frequency bandof 2.4 GHz, corresponding to a wavelength of about 12 cm, or a frequencyband of 5.8 GHz, corresponding to a wavelength of about 5 cm). Forexample, the RF device 2500 may be included in a Wi-Fi-enabled devicesuch as a desktop, a laptop, a video game console, a smart phone, atablet, a smart TV, a digital audio player, a car, a printer, etc. Insome implementations, a Wi-Fi-enabled device may be a node (e.g., asmart sensor) in a smart system configured to communicate data withother nodes. In another example, the RF device 2500 may be used forwireless communications using Bluetooth technology (e.g., a frequencyband from about 2.4 GHz to about 2.485 GHz, corresponding to awavelength of about 12 cm). In other embodiments, the RF device 2500 maybe used for transmitting and/or receiving RF signals for purposes otherthan communication (e.g., in an automotive radar system, or in medicalapplications such as magnetic resonance imaging (MRI)).

In various embodiments, the RF device 2500 may be included infrequency-division duplex (FDD) or time-domain duplex (TDD) variants offrequency allocations that may be used in a cellular network. In an FDDsystem, the uplink (i.e., RF signals transmitted from the UE devices toa BS) and the downlink (i.e., RF signals transmitted from the BS to theUS devices) may use separate frequency bands at the same time. In a TDDsystem, the uplink and the downlink may use the same frequencies but atdifferent times.

A number of components are illustrated in FIG. 37 as included in the RFdevice 2500, but any one or more of these components may be omitted orduplicated, as suitable for the application. For example, in someembodiments, the RF device 2500 may be an RF device supporting both ofwireless transmission and reception of RF signals (e.g., an RFtransceiver), in which case it may include both the components of whatis referred to herein as a transmit (TX) path and the components of whatis referred to herein as a receive (RX) path. However, in otherembodiments, the RF device 2500 may be an RF device supporting onlywireless reception (e.g., an RF receiver), in which case it may includethe components of the RX path, but not the components of the TX path; orthe RF device 2500 may be an RF device supporting only wirelesstransmission (e.g., an RF transmitter), in which case it may include thecomponents of the TX path, but not the components of the RX path.

In some embodiments, some or all of the components included in the RFdevice 2500 may be attached to one or more motherboards. In variousembodiments, the RF device 2500 may not include one or more of thecomponents illustrated in FIG. 37, but the RF device 2500 may includeinterface circuitry for coupling to the one or more components. Forexample, the RF device 2500 may not include an antenna 2502, but mayinclude antenna interface circuitry (e.g., a matching circuitry, aconnector and driver circuitry) to which an antenna 2502 may be coupled.In another set of examples, the RF device 2500 may not include a digitalprocessing unit 2508 or a local oscillator 2506, but may include deviceinterface circuitry (e.g., connectors and supporting circuitry) to whicha digital processing unit 2508 or a local oscillator 2506 may becoupled.

As shown in FIG. 37, the RF device 2500 may include an antenna 2502, aduplexer 2504, a local oscillator 2506, and a digital processing unit2508. As also shown in FIG. 37, the RF device 2500 may include an RXpath that may include an RX path amplifier 2512, an RX path pre-mixfilter 2514, a RX path mixer 2516, an RX path post-mix filter 2518, andan analog-to-digital converter (ADC) 2520. As further shown in FIG. 37,the RF device 2500 may include a TX path that may include a TX pathamplifier 2522, a TX path post-mix filter 2524, a TX path mixer 2526, aTX path pre-mix filter 2528, and a digital-to-analog converter (DAC)2530. Still further, the RF device 2500 may further include an impedancetuner 2532, an RF switch 2534 (which may include, or be included in, anRF circuitry die 166), and control logic 2536. In various embodiments,the RF device 2500 may include multiple instances of any of thecomponents shown in FIG. 37. In some embodiments, the RX path amplifier2512, the TX path amplifier 2522, the duplexer 2504, and the RF switch2534 may be considered to form, or be a part of, an RF FE of the RFdevice 2500; the components of any RF FE of the RF device 2500 may bepart of any of the RF FE modules 180 disclosed herein. In someembodiments, the RX path amplifier 2512, the TX path amplifier 2522, theduplexer 2504, and the RF switch 2534 may be considered to form, or be apart of, an RF FE of the RF device 2500. In some embodiments, the RXpath mixer 2516 and the TX path mixer 2526 (possibly with theirassociated pre-mix and post-mix filters shown in FIG. 37) may beconsidered to form, or be a part of, an RF transceiver of the RF device2500 (or of an RF receiver or an RF transmitter if only RX path or TXpath components, respectively, are included in the RF device 2500). Insome embodiments, the RF device 2500 may further include one or morecontrol logic elements/circuits, shown in FIG. 37 as control logic 2536(providing, for example, an RF FE control interface). The control logic2536 may be used to enhance control of complex RF system environment,support implementation of envelope tracking techniques, reducedissipated power, etc.

The antenna 2502 may be configured to wirelessly transmit and/or receiveRF signals in accordance with any wireless standards or protocols, e.g.,Wi-Fi, LTE, or GSM, as well as any other wireless protocols that aredesignated as 3G, 4G, 5G, and beyond. If the RF device 2500 is an FDDtransceiver, the antenna 2502 may be configured for concurrent receptionand transmission of communication signals in separate, e.g.,non-overlapping and non-continuous, bands of frequencies, e.g., in bandshaving a separation of, e.g., 20 MHz from one another. If the RF device2500 is a TDD transceiver, the antenna 2502 may be configured forsequential reception and transmission of communication signals in bandsof frequencies that may be the same, or overlapping for TX and RX paths.In some embodiments, the RF device 2500 may be a multi-band RF device,in which case the antenna 2502 may be configured for concurrentreception of signals having multiple RF components in separate frequencybands and/or configured for concurrent transmission of signals havingmultiple RF components in separate frequency bands. In such embodiments,the antenna 2502 may be a single wide-band antenna or a plurality ofband-specific antennas (e.g., a plurality of antennas each configured toreceive and/or transmit signals in a specific band of frequencies). Invarious embodiments, the antenna 2502 may include a plurality of antennaelements, e.g., a plurality of antenna elements forming a phased antennaarray (i.e., a communication system or an array of antennas that may usea plurality of antenna elements and phase shifting to transmit andreceive RF signals). Compared to a single-antenna system, a phasedantenna array may offer advantages such as increased gain, ability ofdirectional steering, and simultaneous communication. In someembodiments, the RF device 2500 may include more than one antenna 2502to implement antenna diversity. In some such embodiments, the RF switch2534 may be deployed to switch between different antennas.

An output of the antenna 2502 may be coupled to the input of theduplexer 2504. The duplexer 2504 may be any suitable componentconfigured for filtering multiple signals to allow for bidirectionalcommunication over a single path between the duplexer 2504 and theantenna 2502. The duplexer 2504 may be configured for providing RXsignals to the RX path of the RF device 2500 and for receiving TXsignals from the TX path of the RF device 2500.

The RF device 2500 may include one or more local oscillators 2506,configured to provide local oscillator signals that may be used fordownconversion of the RF signals received by the antenna 2502 and/orupconversion of the signals to be transmitted by the antenna 2502.

The RF device 2500 may include the digital processing unit 2508, whichmay include one or more processing devices. In some embodiments, thedigital processing unit 2508 may be implemented as the processing device1802 of FIG. 46, descriptions of which are provided above. The digitalprocessing unit 2508 may be configured to perform various functionsrelated to digital processing of the RX and/or TX signals. Examples ofsuch functions include, but are not limited to, decimation/downsampling,error correction, digital downconversion or upconversion, DC offsetcancellation, automatic gain control, etc. Although not shown in FIG.37, in some embodiments, the RF device 2500 may further include a memorydevice (e.g., the memory 1804 described above with reference to FIG. 36)configured to cooperate with the digital processing unit 2508.

Turning to the details of the RX path that may be included in the RFdevice 2500, the RX path amplifier 2512 may include a low noiseamplifier (LNA). An input of the RX path amplifier 2512 may be coupledto an antenna port (not shown) of the antenna 2502, e.g., via theduplexer 2504. The RX path amplifier 2512 may amplify the RF signalsreceived by the antenna 2502.

An output of the RX path amplifier 2512 may be coupled to an input ofthe RX path pre-mix filter 2514, which may be a harmonic or band-pass(e.g., low-pass) filter, configured to filter received RF signals thathave been amplified by the RX path amplifier 2512.

An output of the RX path pre-mix filter 2514 may be coupled to an inputof the RX path mixer 2516, also referred to as a downconverter. The RXpath mixer 2516 may include two inputs and one output. A first input maybe configured to receive the RX signals, which may be current signals,indicative of the signals received by the antenna 2502 (e.g., the firstinput may receive the output of the RX path pre-mix filter 2514). Asecond input may be configured to receive local oscillator signals fromone of the local oscillators 2506. The RX path mixer 2516 may then mixthe signals received at its two inputs to generate a downconverted RXsignal, provided at an output of the RX path mixer 2516. As used herein,downconversion refers to a process of mixing a received RF signal with alocal oscillator signal to generate a signal of a lower frequency. Inparticular, the RX path mixer (e.g., downconverter) 2516 may beconfigured to generate the sum and/or the difference frequency at theoutput port when two input frequencies are provided at the two inputports. In some embodiments, the RF device 2500 may implement adirect-conversion receiver (DCR), also known as homodyne, synchrodyne,or zero-intermediate frequency (IF) receiver, in which case the RX pathmixer 2516 may be configured to demodulate the incoming radio signalsusing local oscillator signals whose frequency is identical to, or veryclose to the carrier frequency of the radio signal. In otherembodiments, the RF device 2500 may make use of downconversion to an IF.IFs may be used in superheterodyne radio receivers, in which a receivedRF signal is shifted to an IF before the final detection of theinformation in the received signal is done. Conversion to an IF may beuseful for several reasons. For example, when several stages of filtersare used, they can all be set to a fixed frequency, which makes themeasier to build and to tune. In some embodiments, the RX path mixer 2516may include several such stages of IF conversion.

Although a single RX path mixer 2516 is shown in the RX path of FIG. 37,in some embodiments, the RX path mixer 2516 may be implemented as aquadrature downconverter, in which case it would include a first RX pathmixer and a second RX path mixer. The first RX path mixer may beconfigured for performing downconversion to generate an in-phase (I)downconverted RX signal by mixing the RX signal received by the antenna2502 and an in-phase component of the local oscillator signal providedby the local oscillator 2506. The second RX path mixer may be configuredfor performing downconversion to generate a quadrature (Q) downconvertedRX signal by mixing the RX signal received by the antenna 2502 and aquadrature component of the local oscillator signal provided by thelocal oscillator 2506 (the quadrature component is a component that isoffset, in phase, from the in-phase component of the local oscillatorsignal by 90 degrees). The output of the first RX path mixer may beprovided to an I-signal path, and the output of the second RX path mixermay be provided to a Q-signal path, which may be substantially 90degrees out of phase with the I-signal path.

The output of the RX path mixer 2516 may, optionally, be coupled to theRX path post-mix filter 2518, which may be low-pass filters. In case theRX path mixer 2516 is a quadrature mixer that implements the first andsecond mixers as described above, the in-phase and quadrature componentsprovided at the outputs of the first and second mixers respectively maybe coupled to respective individual first and second RX path post-mixfilters included in the RX path post-mix filter 2518.

The ADC 2520 may be configured to convert the mixed RX signals from theRX path mixer 2516 from the analog to the digital domain. The ADC 2520may be a quadrature ADC that, similar to the RX path mixer 2516, mayinclude two ADCs, configured to digitize the downconverted RX pathsignals separated in in-phase and quadrature components. The output ofthe ADC 2520 may be provided to the digital processing unit 2508,configured to perform various functions related to digital processing ofthe RX signals so that information encoded in the RX signals can beextracted.

Turning to the details of the TX path that may be included in the RFdevice 2500, the digital signal to later be transmitted (TX signal) bythe antenna 2502 may be provided, from the digital processing unit 2508,to the DAC 2530. Similar to the ADC 2520, the DAC 2530 may include twoDACs, configured to convert, respectively, digital I- and Q-path TXsignal components to analog form.

Optionally, the output of the DAC 2530 may be coupled to the TX pathpre-mix filter 2528, which may be a band-pass (e.g., low-pass) filter(or a pair of band-pass, e.g., low-pass, filters, in case of quadratureprocessing) configured to filter out, from the analog TX signals outputby the DAC 2530, the signal components outside of the desired band. Thedigital TX signals may then be provided to the TX path mixer 2526, whichmay also be referred to as an upconverter. Similar to the RX path mixer2516, the TX path mixer 2526 may include a pair of TX path mixers, forin-phase and quadrature component mixing. Similar to the first andsecond RX path mixers that may be included in the RX path, each of theTX path mixers of the TX path mixer 2526 may include two inputs and oneoutput. A first input may receive the TX signal components, converted tothe analog form by the respective DAC 2530, which are to be upconvertedto generate RF signals to be transmitted. The first TX path mixer maygenerate an in-phase (I) upconverted signal by mixing the TX signalcomponent converted to analog form by the DAC 2530 with the in-phasecomponent of the TX path local oscillator signal provided from the localoscillator 2506 (in various embodiments, the local oscillator 2506 mayinclude a plurality of different local oscillators, or be configured toprovide different local oscillator frequencies for the RX path mixer2516 in the RX path and the TX path mixer 2526 in the TX path). Thesecond TX path mixer may generate a quadrature phase (Q) upconvertedsignal by mixing the TX signal component converted to analog form by theDAC 2530 with the quadrature component of the TX path local oscillatorsignal. The output of the second TX path mixer may be added to theoutput of the first TX path mixer to create a real RF signal. A secondinput of each of the TX path mixers may be coupled the local oscillator2506.

Optionally, the RF device 2500 may include the TX path post-mix filter2524, configured to filter the output of the TX path mixer 2526.

As noted above, the TX path amplifier 2522 may be a power amplifierconfigured to amplify the upconverted RF signal before providing it tothe antenna 2502 for transmission

In various embodiments, any of the RX path pre-mix filter 2514, the RXpath post-mix filter 2518, the TX path post-mix filter 2524, and the TXpath pre-mix filter 2528 may be implemented as RF filters. In someembodiments, each of such RF filters may include one or more resonators(e.g., AWRs, bulk acoustic resonators (BARs), Lamb wave resonators,and/or contour-wave resonators), arranged in any suitable manner (e.g.,in a ladder configuration). Any of these resonators may be part of aresonator component 148 in a lidded resonator assembly 164 and/or an RFFE module 180. Any of the RX path pre-mix filter 2514, the RX pathpost-mix filter 2518, the TX path post-mix filter 2524, and the TX pathpre-mix filter 2528 may include one or more resonator components 148,and thus be may include or be part of a lidded resonator assembly 164and/or an RF FE module 180. As discussed above with reference to theresonator component 148, an individual resonator (e.g., the resonator156) of an RF filter may include a layer of a piezoelectric materialsuch as aluminum nitride, enclosed between two or more electrodes orsets of electrodes, with a cavity (e.g., the cavity 160) provided arounda portion of each electrode or set of electrodes in order to allow aportion of the piezoelectric material to vibrate during operation of thefilter. In some embodiments, an RF filter may be implemented as aplurality of RF filters, or a filter bank. A filter bank may include aplurality of RF resonators that may be coupled to a switch (e. g., theRF switch 2534) configured to selectively switch any one of theplurality of RF resonators on and off (e.g., activate any one of theplurality of RF resonators), in order to achieve desired filteringcharacteristics of the filter bank (e.g., in order to program the filterbank). For example, such a filter bank may be used to switch betweendifferent RF frequency ranges when the RF device 2500 is, or is includedin, a BS or in a UE device. In another example, such a filter bank maybe programmable to suppress TX leakage on the different duplexdistances.

The impedance tuner 2532 may include any suitable circuitry, configuredto match the input and output impedances of the different RF circuitriesto minimize signal losses in the RF device 2500. For example, theimpedance tuner 2532 may include an antenna impedance tuner. Being ableto tune the impedance of the antenna 2502 may be particularlyadvantageous because antenna's impedance is a function of theenvironment that the RF device 2500 is in, e.g., antenna's impedancechanges depending on, e.g., if the antenna is held in a hand, placed ona car roof, etc.

As described above, the RF switch 2534 may be a device configured toroute high-frequency signals through transmission paths in order toselectively switch between a plurality of instances of any one of thecomponents shown in FIG. 37 (e.g., to achieve desired behavior andcharacteristics of the RF device 2500). The RF switch 2534 may beincluded in an RF circuitry die 166. In some embodiments, an RF switch2534 may be used to switch between different antennas 2502. In otherembodiments, an RF switch may be used to switch between a plurality ofRF resonators (e.g., by selectively switching RF resonators on and off)of any of the filters included in the RF device 2500. Typically, an RFsystem may include a plurality of such RF switches.

The RF device 2500 provides a simplified version and, in furtherembodiments, other components not specifically shown in FIG. 37 may beincluded. For example, the RX path of the RF device 2500 may include acurrent-to-voltage amplifier between the RX path mixer 2516 and the ADC2520, which may be configured to amplify and convert the downconvertedsignals to voltage signals. In another example, the RX path of the RFdevice 2500 may include a balun transformer for generating balancedsignals. In yet another example, the RF device 2500 may further includea clock generator, which may include a suitable phase-lock loop (PLL),configured to receive a reference clock signal and use it to generate adifferent clock signal that may then be used for timing the operation ofthe ADC 2520, the DAC 2530, and/or that may also be used by the localoscillator 2506 to generate the local oscillator signals to be used inthe RX path or the TX path.

The following paragraphs provide various examples of the embodimentsdisclosed herein.

Example 1 is an integrated circuit (IC) structure, including: aninorganic die including a conductive pathway from a first face of theinorganic die to a second, opposing face of the inorganic die; organicinterconnect layers on the inorganic die, wherein the organicinterconnect layers include an organic dielectric and the conductivepathway is in electrical contact with conductive lines and vias of theorganic interconnect layers; and an inductor in the organic interconnectlayers, wherein the inductor includes conductive lines and vias of theorganic interconnect layers.

Example 2 includes the subject matter of Example 1, and furtherspecifies that the inorganic die includes an inorganic substrate, andthe inorganic substrate includes glass or a semiconductor material.

Example 3 includes the subject matter of any of Examples 1-2, andfurther specifies that the inorganic die includes one or more inorganicinterconnect layers, and the inorganic interconnect layers include aninorganic dielectric.

Example 4 includes the subject matter of Example 3, and furtherspecifies that the one or more inorganic interconnect layers are betweenan inorganic substrate of the inorganic die and the organic interconnectlayers.

Example 5 includes the subject matter of any of Examples 1-4, andfurther specifies that the inorganic die includes at least one devicelayer.

Example 6 includes the subject matter of Example 5, and furtherspecifies that the at least one device layer includes one or moretransistors or one or more diodes.

Example 7 includes the subject matter of any of Examples 1-6, andfurther specifies that the conductive pathway from the first face of theinorganic die to the second face of the inorganic die includes at leastone through-substrate via (TSV).

Example 8 includes the subject matter of Example 7, and furtherspecifies that the TSV has a tapered shape, narrowing towards theorganic interconnect layers.

Example 9 includes the subject matter of any of Examples 7-8, andfurther includes: metal pillars, wherein the inorganic die is betweenthe metal pillars and the organic interconnect layers.

Example 10 includes the subject matter of Example 9, and furtherincludes: solder on the metal pillars, wherein the metal pillars arebetween the solder and the inorganic die.

Example 11 includes the subject matter of any of Examples 1-10, andfurther specifies that the organic dielectric has a loss tangent that isless than 0.01.

Example 12 includes the subject matter of any of Examples 1-11, andfurther specifies that the organic dielectric has a loss tangent that isless than 0.001.

Example 13 includes the subject matter of any of Examples 1-12, andfurther specifies that a thickness of an organic dielectric in at leastone of the organic interconnect layers is between 10 microns and 60microns.

Example 14 includes the subject matter of any of Examples 1-13, andfurther specifies that a height of conductive lines in at least one ofthe organic interconnect layers is between 5 microns and 35 microns.

Example 15 includes the subject matter of any of Examples 1-14, andfurther includes: solder in contact with conductive contacts of theorganic interconnect layers, wherein the organic interconnect layers arebetween the solder and the inorganic die.

Example 16 includes the subject matter of any of Examples 1-15, andfurther specifies that the organic dielectric has a coefficient ofthermal expansion that is less than 20 parts per million per degreeCelsius.

Example 17 includes the subject matter of any of Examples 1-16, andfurther specifies that a number of the organic interconnect layers inthe IC structure is between 2 and 8.

Example 18 includes the subject matter of any of Examples 1-17, andfurther specifies that the organic interconnect layers include a firstorganic interconnect layer and a second organic interconnect layer, thefirst organic interconnect layer is between the second organicinterconnect layer and the inorganic die, and the first organicinterconnect layer has a thickness that is greater than a thickness ofthe second organic interconnect layer.

Example 19 is a lidded resonator assembly, including: a resonatorcomponent; and an IC structure hermetically coupled to the resonatorcomponent, wherein the IC structure includes an inorganic die andorganic interconnect layers on the inorganic die, the organicinterconnect layers include an organic dielectric, and the inorganic dieis between the resonator component and the organic interconnect layers.

Example 20 includes the subject matter of Example 19, and furtherspecifies that the resonator component includes acoustic waveresonators, bulk acoustic resonators, Lamb wave resonators, orcontour-wave resonators.

Example 21 includes the subject matter of any of Examples 19-20, andfurther specifies that the IC structure includes a ring on the inorganicdie, the resonator component includes a ring, and the rings are coupledtogether with solder.

Example 22 includes the subject matter of any of Examples 19-21, andfurther specifies that resonators of the resonator component are in air,in nitrogen gas, or under vacuum.

Example 23 includes the subject matter of any of Examples 19-22, andfurther specifies that an electrical pathway in the resonator componentis electrically coupled to an electrical pathway in the IC structure.

Example 24 includes the subject matter of Example 23, and furtherspecifies that the electrical pathway in the IC structure includes athrough-substrate via (TSV).

Example 25 includes the subject matter of any of Examples 19-24, andfurther specifies that the inorganic die includes an inorganicsubstrate, and the inorganic substrate includes glass or a semiconductormaterial.

Example 26 includes the subject matter of any of Examples 19-25, andfurther specifies that the inorganic die includes inorganic interconnectlayers, and the inorganic interconnect layers include an inorganicdielectric.

Example 27 includes the subject matter of Example 26, and furtherspecifies that the inorganic interconnect layers are between aninorganic substrate of the inorganic die and the organic interconnectlayers.

Example 28 includes the subject matter of any of Examples 19-27, andfurther specifies that the inorganic die includes at least one devicelayer.

Example 29 includes the subject matter of Example 28, and furtherspecifies that the at least one device layer includes one or moretransistors or one or more diodes.

Example 30 includes the subject matter of any of Examples 19-29, andfurther specifies that a through-substrate via (TSV) of the inorganicdie is in electrical contact with a conductive pathway of the organicinterconnect layers.

Example 31 includes the subject matter of any of Examples 19-30, andfurther specifies that the organic dielectric has a loss tangent that isless than 0.01.

Example 32 includes the subject matter of any of Examples 19-31, andfurther specifies that the organic dielectric has a loss tangent that isless than 0.001.

Example 33 includes the subject matter of any of Examples 19-32, andfurther specifies that a thickness of an organic dielectric in at leastone of the organic interconnect layers is between 10 microns and 60microns.

Example 34 includes the subject matter of any of Examples 19-33, andfurther specifies that a height of conductive lines in at least one ofthe organic interconnect layers is between 5 microns and 35 microns.

Example 35 includes the subject matter of any of Examples 19-34, andfurther specifies that the organic dielectric has a coefficient ofthermal expansion that is less than 20 parts per million per degreeCelsius.

Example 36 includes the subject matter of any of Examples 19-35, andfurther specifies that a number of the organic interconnect layers inthe IC structure is between 2 and 8.

Example 37 includes the subject matter of any of Examples 19-36, andfurther specifies that the organic interconnect layers include a firstorganic interconnect layer and a second organic interconnect layer, thefirst organic interconnect layer is between the second organicinterconnect layer and the inorganic die, and the first organicinterconnect layer has a thickness that is greater than a thickness ofthe second organic interconnect layer.

Example 38 is a radio frequency (RF) front-end (FE) module, including: alidded resonator assembly including an IC structure having an inorganicdie proximate to a first face of the IC structure and organicinterconnect layers proximate to a second, opposing face of the ICstructure, wherein the lidded resonator assembly also includes aresonator component hermetically coupled to the inorganic die; and an RFcircuitry die electrically coupled to the lidded resonator assembly.

Example 39 includes the subject matter of Example 38, and furtherspecifies that the resonator component includes acoustic waveresonators, bulk acoustic resonators, Lamb wave resonators, orcontour-wave resonators.

Example 40 includes the subject matter of any of Examples 38-39, andfurther specifies that the IC structure includes a ring on the inorganicdie, the resonator component includes a ring, and the rings are coupledtogether with solder.

Example 41 includes the subject matter of any of Examples 38-40, andfurther specifies that resonators of the resonator component are in air,in nitrogen gas, or under vacuum.

Example 42 includes the subject matter of any of Examples 38-41, andfurther specifies that an electrical pathway in the resonator componentis electrically coupled to an electrical pathway in the IC structure.

Example 43 includes the subject matter of Example 42, and furtherspecifies that the electrical pathway in the IC structure includes athrough-substrate via (TSV).

Example 44 includes the subject matter of any of Examples 38-43, andfurther specifies that the inorganic die includes an inorganicsubstrate, and the inorganic substrate includes glass or a semiconductormaterial.

Example 45 includes the subject matter of any of Examples 38-44, andfurther specifies that the inorganic die includes one or more inorganicinterconnect layers, and the inorganic interconnect layers include aninorganic dielectric.

Example 46 includes the subject matter of Example 45, and furtherspecifies that the one or more inorganic interconnect layers are betweenan inorganic substrate of the inorganic die and the organic interconnectlayers.

Example 47 includes the subject matter of any of Examples 38-46, andfurther specifies that the inorganic die includes at least one devicelayer.

Example 48 includes the subject matter of Example 47, and furtherspecifies that the at least one device layer includes one or moretransistors or one or more diodes.

Example 49 includes the subject matter of any of Examples 38-48, andfurther specifies that a through-substrate via (TSV) of the inorganicdie is in electrical contact with a conductive pathway of the organicinterconnect layers.

Example 50 includes the subject matter of any of Examples 38-49, andfurther specifies that an organic dielectric of the organic interconnectlayers has a loss tangent that is less than 0.01.

Example 51 includes the subject matter of any of Examples 38-50, andfurther specifies that an organic dielectric of the organic interconnectlayers has a loss tangent that is less than 0.001.

Example 52 includes the subject matter of any of Examples 38-51, andfurther specifies that a thickness of an organic dielectric in at leastone of the organic interconnect layers is between 10 microns and 60microns.

Example 53 includes the subject matter of any of Examples 38-52, andfurther specifies that a height of conductive lines in at least one ofthe organic interconnect layers is between 5 microns and 35 microns.

Example 54 includes the subject matter of any of Examples 38-53, andfurther specifies that an organic dielectric of the organic interconnectlayers has a coefficient of thermal expansion that is less than 20 partsper million per degree Celsius.

Example 55 includes the subject matter of any of Examples 38-54, andfurther specifies that a number of the organic interconnect layersbetween the inorganic die and the RF circuitry die is between 2 and 8.

Example 56 includes the subject matter of any of Examples 38-55, andfurther specifies that the organic interconnect layers include a firstorganic interconnect layer and a second organic interconnect layer, thefirst organic interconnect layer is between the second organicinterconnect layer and the inorganic die, and the first organicinterconnect layer has a thickness that is greater than a thickness ofthe second organic interconnect layer.

Example 57 includes the subject matter of any of Examples 38-56, andfurther specifies that the RF circuitry die includes power amplifiercircuitry, switching circuitry, driver circuitry, or matching networkcircuitry.

Example 58 includes the subject matter of any of Examples 38-57, andfurther specifies that the organic interconnect layers include aninductor, and the inductor includes conductive lines and vias of theorganic interconnect layers.

Example 59 includes the subject matter of any of Examples 38-58, andfurther specifies that the RF circuitry die is electrically coupled tothe lidded resonator assembly by a package substrate.

Example 60 includes the subject matter of Example 59, and furtherspecifies that the RF circuitry die is coupled to a first face of thepackage substrate, and the lidded resonator assembly is coupled to asecond, opposing face of the package substrate.

Example 61 includes the subject matter of any of Examples 59-60, andfurther includes: solder interconnects coupled to the package substrate,wherein a height of the solder interconnects is greater than a height ofthe lidded resonator assembly.

Example 62 includes the subject matter of any of Examples 59-61, andfurther specifies that the package substrate is an organic packagesubstrate.

Example 63 includes the subject matter of any of Examples 59-62, andfurther specifies that one or more inductors, resistors, transmissionlines, or capacitors is included in the organic package substrate.

Example 64 includes the subject matter of any of Examples 38-58, andfurther specifies that the RF circuitry die is electrically coupled tothe lidded resonator assembly by solder in contact with the RF circuitrydie and the lidded resonator assembly.

Example 65 includes the subject matter of Example 64, and furtherspecifies that the solder is in contact with conductive contacts of theorganic interconnect layers.

Example 66 includes the subject matter of any of Examples 64-65, andfurther includes: underfill material around the solder.

Example 67 includes the subject matter of any of Examples 64-66, andfurther includes: solder interconnects coupled to the RF circuitry die,wherein a height of the solder interconnects is greater than a height ofthe lidded resonator assembly.

Example 68 includes the subject matter of Example 67, and furtherspecifies that the solder interconnects are coupled to a same face ofthe RF circuitry die as the lidded resonator assembly.

Example 69 includes the subject matter of any of Examples 64-65, andfurther includes: a mold material around the lidded resonator assembly.

Example 70 includes the subject matter of Example 69, and furtherincludes: through-mold vias (TMVs) through the mold material and incontact with conductive contacts at a face of the RF circuitry die.

Example 71 includes the subject matter of Example 70, and furtherspecifies that the TMVs include solder.

Example 72 includes the subject matter of any of Examples 69-71, andfurther specifies that the lidded resonator assembly is coupled to aface of the RF circuitry die, and the mold material contacts the sameface of the RF circuitry die.

Example 73 includes the subject matter of any of Examples 64-65, andfurther includes: a mold material around the RF circuitry die and incontact with a face of the lidded resonator assembly proximate to theorganic interconnect layers.

Example 74 includes the subject matter of Example 73, and furtherincludes: solder interconnects coupled to the first face of the ICstructure, wherein a height of the solder interconnects is greater thana height of the resonator component.

Example 75 includes the subject matter of any of Examples 38-74, andfurther specifies that the lidded resonator assembly includes underfillmaterial between the resonator component and the IC structure.

Example 76 is a communication device, including: a circuit board; andthe RF FE module of any of claims 38-75, coupled to the circuit board.

Example 77 includes the subject matter of Example 76, and furtherspecifies that the circuit board is a motherboard.

Example 78 includes the subject matter of any of Examples 76-77, andfurther includes: an antenna communicatively coupled to the RF circuitrydie.

Example 79 includes the subject matter of any of Examples 76-78, andfurther specifies that the communication device is a wearable device, ahandheld device, or a laptop computing device.

Example 80 is a method of manufacturing including any of the methods ofmanufacturing disclosed herein.

1. A method for fabricating an integrated circuit (IC) structure,comprising: forming organic interconnect layers over an inorganicinterconnect substrate; and forming passive components in the organicinterconnect layers, wherein: the organic interconnect layers comprise aplurality of conductive metal layers through an organic dielectricmaterial, the plurality of conductive metal layers comprises electricalpathways, and the passive components are electrically coupled to theelectrical pathways.
 2. The method of claim 1, further comprising:forming at least one via in the organic interconnect layers electricallycoupling at least two layers in the plurality of conductive metallayers.
 3. The method of claim 2, wherein forming the at least one viaincludes performing a lithographic via process.
 4. The method of claim1, further comprising: disposing a solder resist material over theorganic interconnect layers; exposing a conductive contact in theorganic interconnect layers through an opening in the solder resistmaterial; and disposing solder into the opening in electrical contactwith the conductive contact.
 5. The method of claim 4, wherein disposingthe solder resist material comprises laminating or spraying the solderresist material over the organic interconnect layers.
 6. The method ofclaim 1, wherein the inorganic interconnect substrate comprisesfrontside interconnect layers disposed on a surface of the inorganicinterconnect substrate, and the organic interconnect layers are formedover the frontside interconnect layers.
 7. The method of claim 1,wherein the passive components include an inductor.
 8. The method ofclaim 1, wherein the inorganic interconnect substrate comprises at leastone device layer.
 9. The method of claim 1, wherein the organicinterconnect layers are formed over a barrier material, such that thebarrier material is between the inorganic substrate and the organicinterconnect layers.
 10. The method of claim 1, further comprisingcoupling an IC die to the organic interconnect layers.
 11. The method ofclaim 1, wherein the IC structure comprises a radio frequency (RF) ICdie.
 12. The method of claim 10, wherein coupling the IC die comprisessoldering the IC die to conductive contacts on the organic interconnectlayers.
 13. A method for fabricating an RF front-end (FE) module,comprising: coupling a resonator component to a ring-shaped conductivecontact on a back side of an IC die to form a lidded resonator assembly;coupling an RF circuitry die to a first face of a package substrate; andcoupling the lidded resonator assembly to a second face of the packagesubstrate, the second face being opposite to the first face.
 14. Themethod of claim 13, wherein the IC die comprises organic interconnectlayers over inorganic interconnect layers.
 15. The method of claim 13,wherein coupling the lidded resonator assembly to the second face of thepackage substrate comprises soldering conductive contacts of the IC dieto the second face of the package, wherein the conductive contacts areon a front side of the IC die, the front side being opposite to the backside.
 16. The method of claim 15, further comprising providing anunderfill between the front face of the IC die and the second face ofthe package around the conductive contacts.
 17. A method for fabricatingan RF FE module, comprising: coupling a resonator component to aring-shaped conductive contact on a back side of an IC die to form alidded resonator assembly; coupling the lidded resonator assembly to aface of an RF circuitry die; disposing mold compound around the liddedresonator assembly; and forming through-mold vias (TMVs) in the moldcompound to expose conductive contacts on the face of the RF circuitrydie.
 18. The method of claim 17, wherein the RF circuitry die comprisesorganic interconnect layers over inorganic interconnect layers.
 19. Themethod of claim 17, wherein coupling the lidded resonator assembly tothe face of the RF circuitry die comprises soldering the conductivecontacts of the IC die to the RF circuitry die, wherein the conductivecontacts are on a front side of the IC die, the front side beingopposite to the back side.
 20. The method of claim 17, wherein formingthe TMVs comprises forming cavities in the mold compound and filling thecavities with conductive material.